English Barebone Lex Task 3I170DW-2CXX
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Barebone Lex Task 3I170DW-2CXX
- CPU Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 de 6.a / 7.a generación
- Chipset Intel® Q170
- 1 x zócalo SODIMM DDR4, máx. 16 GB
- Pantalla independiente múltiple: VGA y HDMI
- 5 x Intel GbE LAN, 2 x USB 3.0, 2 x USB 2.0, 2 x COM
- 2 x Mini PCIe, 1 x SIM, Audio
P/N: TA3I170DW-2CXX
785,35 € Sin IVA
950,27 € Con IVA
Este producto no está disponible ni en nuestro almacén ni en ninguno de nuestros proveedores en estos momentos.
El precio que aparece es orientativo
El precio que aparece es orientativo
Asistencia
personalizada
personalizada
Envío
asegurado
asegurado
100%
pago seguro
pago seguro
Fanless Embedded Computer with 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 processor
| System Dimension(WxDxH) | 210W x 125D x 77H mm | |
| Weight(Incl.M/B) | 1.9 kg | |
| CPU | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU | |
| Chipset | Intel ® Q170 | |
| Memory | 1 x DDR4 SODIMM socket, Max. 16GB | |
| Storage | mSATA, HDD / SSD* | |
| Expansion slots | 1 x Full-size Mini PCIe (PCIe / mSATA / USB) 1 x Half-size Mini PCIe (PCIe / mSATA / USB) 1 x SIM |
|
| I/O ports | Network | 5 x Intel GbE |
| USB | 2 x USB 3.0, 2 x USB 2.0 | |
| Serial ports | 2 x RS232 / 422 / 485 | |
| Display | 1 x VGA, 1 x HDMI | |
| Audio | Line-out / Mic-in | |
| GPIO | DI / DO (Option) | |
| Optional Modules & Accessory |
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI/DO, Video Input *SATA Kit, VESA Mounting Kit |
|
| Power | DC input : +9~36V AC input : External adapter 100 / 240V ; AC-DC 84W |
|
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD | |
| Storage Temp. | -20°C to +70°C | |
| Relative Humidity | 95% @ 40°C, non-condensing | |
Fanless Embedded Computer with 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 processor
| System Dimension(WxDxH) | 210W x 125D x 77H mm | |
| Weight(Incl.M/B) | 1.9 kg | |
| CPU | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU | |
| Chipset | Intel ® Q170 | |
| Memory | 1 x DDR4 SODIMM socket, Max. 16GB | |
| Storage | mSATA, HDD / SSD* | |
| Expansion slots | 1 x Full-size Mini PCIe (PCIe / mSATA / USB) 1 x Half-size Mini PCIe (PCIe / mSATA / USB) 1 x SIM |
|
| I/O ports | Network | 5 x Intel GbE |
| USB | 2 x USB 3.0, 2 x USB 2.0 | |
| Serial ports | 2 x RS232 / 422 / 485 | |
| Display | 1 x VGA, 1 x HDMI | |
| Audio | Line-out / Mic-in | |
| GPIO | DI / DO (Option) | |
| Optional Modules & Accessory |
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI/DO, Video Input *SATA Kit, VESA Mounting Kit |
|
| Power | DC input : +9~36V AC input : External adapter 100 / 240V ; AC-DC 84W |
|
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD | |
| Storage Temp. | -20°C to +70°C | |
| Relative Humidity | 95% @ 40°C, non-condensing | |
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