English Barebone Lex Apollo RS PM170DW-4CXX
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Barebone Lex Apollo RS PM170DW-4CXX
- CPU Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 de 6.a / 7.a generación
- Chipset Intel® Q170
- 2 x zócalo SODIMM DDR4, máx. 32GB
- Pantalla independiente múltiple: HDMI y VGA
- 5 x Intel GbE LAN, 4 x USB 3.0, 2 x COM, 2 x SIM
- 2 x Mini PCIe, M.2, PCIe x16
P/N: APRSPM170DW-4CXX
988,78 € Sin IVA
1.196,42 € Con IVA
Este producto no está disponible ni en nuestro almacén ni en ninguno de nuestros proveedores en estos momentos.
El precio que aparece es orientativo
El precio que aparece es orientativo
Asistencia
personalizada
personalizada
Envío
asegurado
asegurado
100%
pago seguro
pago seguro
High Performance 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 Fanless Embedded Computers / Stackable configuration Computer for CPU board & PCIe Backplanes / Flexibility I/O / expansion PCIe x 16
| System Dimension (WxDxH) | 231W x 93D x 173H mm |
| Weight (Incl.M/B) | 3.82 kg |
| CPU | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU |
| Chipset | Intel® Q170 |
| Memory | 2 x DDR4 SODIMM socket, Max. 32GB |
| Storage | mSATA, HDD / SSD*, M.2 |
| Expansion slots | 1 x Full-size Mini PCIe (PCIe / mSATA / USB) 1 x Full-size Mini PCIe (PCIe / USB) |
| I/O ports | Network: 5 x Intel GbE USB: 4 x USB 3.0 Serial ports: 2 x RS232 / 422 / 485 Display: 1 x VGA, 1 x HDMI PCIe slot: 1 x PCIe slot via RS701 |
| Optional Modules & Accessory | GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI/DO, Video Input, *SATA Kit, Wall Mount Kit |
| OEM IO Function | Audio, LAN, USB, DIO |
| Power | DC input: +12V~24V AC input: External adapter 100 / 240V AC-DC 120W |
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD (Core i6700 TE) 0°C to +50°C with HDD(Core i6700) |
| Storage Temp. | -20°C to +70°C |
| Relative Humidity | 95% @ 40°C, non-condensing |
High Performance 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 Fanless Embedded Computers / Stackable configuration Computer for CPU board & PCIe Backplanes / Flexibility I/O / expansion PCIe x 16
| System Dimension (WxDxH) | 231W x 93D x 173H mm |
| Weight (Incl.M/B) | 3.82 kg |
| CPU | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU |
| Chipset | Intel® Q170 |
| Memory | 2 x DDR4 SODIMM socket, Max. 32GB |
| Storage | mSATA, HDD / SSD*, M.2 |
| Expansion slots | 1 x Full-size Mini PCIe (PCIe / mSATA / USB) 1 x Full-size Mini PCIe (PCIe / USB) |
| I/O ports | Network: 5 x Intel GbE USB: 4 x USB 3.0 Serial ports: 2 x RS232 / 422 / 485 Display: 1 x VGA, 1 x HDMI PCIe slot: 1 x PCIe slot via RS701 |
| Optional Modules & Accessory | GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI/DO, Video Input, *SATA Kit, Wall Mount Kit |
| OEM IO Function | Audio, LAN, USB, DIO |
| Power | DC input: +12V~24V AC input: External adapter 100 / 240V AC-DC 120W |
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD (Core i6700 TE) 0°C to +50°C with HDD(Core i6700) |
| Storage Temp. | -20°C to +70°C |
| Relative Humidity | 95% @ 40°C, non-condensing |
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