English 
Supermicro MBD-X11SPH-NCTF. Socket 3647. BULK.
- Placa base ATX.
- Chipset Intel C622.
- Compatible con procesadores Intel Xeon Scalable de 2ª generación.
- Socket 3647.
- Hasta 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots.
- 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8).
- Dual LAN with 10GBase-T with Intel® X722 + X557.
El precio que aparece es orientativo
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asegurado
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Supermicro X11SPH-nCTF. Fabricante del procesador: Intel, Zócalo del procesador: LGA 3647 (Socket P), Procesador compatible: Intel® Xeon®. Tipos de memoria compatibles: DDR4-SDRAM, Memoria interna máxima: 1000 GB, Voltaje de la memoria: 1,2 V. Interfaces de disco de almacenamiento compatibles: SATA III, Niveles de RAID: 0, 1, 5, 10. Modelo de adaptador de gráficos integrado: Aspeed AST2500. Tipo de interfaz Ethernet: 10 Gigabit Ethernet.
Principales características...
* Placa base ATX.
* Chipset Intel C622.
* Compatible con procesadores Intel Xeon Scalable de 2ª generación.
* Socket 3647.
* Hasta 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots.
* 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8).
* Dual LAN with 10GBase-T with Intel® X722 + X557.
| CPU | 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP |
| Chipset | Intel C622 |
| Memoria | 8 DIMM slots Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz |
| Gráficos | |
| Audio | |
| LAN | Dual LAN with 10GBase-T with Intel® X722 + X557 |
| Ranuras de expansión | 1 PCI-E 3.0 x16 (x16 or x8 ), 1 PCI-E 3.0 x8 (x0 or x8 ), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot) |
| Almacenaje | Intel® C622 controller for 10 SATA3 (6 Gbps) ports |
| RAID | RAID 0,1,5,10 |
| Conectores E/S internos | 2x USB 3.0 6x USB 2.0 1x COM |
| Conectores E/S traseros | 2x USB 3.0 2x USB 2.0 1x VGA 1x COM |
| S.O. soportado | |
| Formato | ATX (30.48cm x 24.38cm) |
| BIOS | AMI UEFI |
Supermicro X11SPH-nCTF. Fabricante del procesador: Intel, Zócalo del procesador: LGA 3647 (Socket P), Procesador compatible: Intel® Xeon®. Tipos de memoria compatibles: DDR4-SDRAM, Memoria interna máxima: 1000 GB, Voltaje de la memoria: 1,2 V. Interfaces de disco de almacenamiento compatibles: SATA III, Niveles de RAID: 0, 1, 5, 10. Modelo de adaptador de gráficos integrado: Aspeed AST2500. Tipo de interfaz Ethernet: 10 Gigabit Ethernet.
Principales características...
* Placa base ATX.
* Chipset Intel C622.
* Compatible con procesadores Intel Xeon Scalable de 2ª generación.
* Socket 3647.
* Hasta 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots.
* 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8).
* Dual LAN with 10GBase-T with Intel® X722 + X557.
| CPU | 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP |
| Chipset | Intel C622 |
| Memoria | 8 DIMM slots Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz |
| Gráficos | |
| Audio | |
| LAN | Dual LAN with 10GBase-T with Intel® X722 + X557 |
| Ranuras de expansión | 1 PCI-E 3.0 x16 (x16 or x8 ), 1 PCI-E 3.0 x8 (x0 or x8 ), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot) |
| Almacenaje | Intel® C622 controller for 10 SATA3 (6 Gbps) ports |
| RAID | RAID 0,1,5,10 |
| Conectores E/S internos | 2x USB 3.0 6x USB 2.0 1x COM |
| Conectores E/S traseros | 2x USB 3.0 2x USB 2.0 1x VGA 1x COM |
| S.O. soportado | |
| Formato | ATX (30.48cm x 24.38cm) |
| BIOS | AMI UEFI |
