Amd Epyc 7373X 3.05Ghz. Socket SP3. TRAY.
- Procesador: AMD EPYC 7373X
- Nucleos/subprocesos: 16/32
- Socket: SP3
- Cache: 768Mb
- TDP: 280W
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The 3rd Generation AMD EPYC™ lineup offers the world's most powerful x86 server CPUs, AMD Infinity Architecture breaks down all barriers in x86 performance, efficiency, security features, and overall system performance to meet the promise of the next generation of high-performance computing and enterprise data centers.
Data centers that need the best CPU performance, the best security features and the best scalability count on AMD EPYC™ processors.
AMD Infinity Guard helps minimize potential attack surfaces when software starts, runs, or accesses your important data.
Main features...
* Processor: AMD EPYC 7773X
* Cores/Threads: 16/32.
* Socket: SP3
* Cache: 768Mb.
*TDP: 240W.
serie | AMD Epyc |
Hilera | AMD Epyc 7000 |
modelo | 7373X |
núcleos | dieciséis |
hilos | 32 |
reloj base | 3,05 GHz |
reloj turbo | 3,80 GHz |
base | AMD SP3 |
nombre clave | Milán-X |
arquitectura | Zen 3 |
producción | 7 nm |
caché L2 | 8MB |
caché L3 | 768 MB |
carriles PCIE | 128x PCIe 4.0 |
TDP | 240 vatios |
Gráficos integrados | ninguna |
embalaje | BANDEJA |
The 3rd Generation AMD EPYC™ lineup offers the world's most powerful x86 server CPUs, AMD Infinity Architecture breaks down all barriers in x86 performance, efficiency, security features, and overall system performance to meet the promise of the next generation of high-performance computing and enterprise data centers.
Data centers that need the best CPU performance, the best security features and the best scalability count on AMD EPYC™ processors.
AMD Infinity Guard helps minimize potential attack surfaces when software starts, runs, or accesses your important data.
Main features...
* Processor: AMD EPYC 7773X
* Cores/Threads: 16/32.
* Socket: SP3
* Cache: 768Mb.
*TDP: 240W.
serie | AMD Epyc |
Hilera | AMD Epyc 7000 |
modelo | 7373X |
núcleos | dieciséis |
hilos | 32 |
reloj base | 3,05 GHz |
reloj turbo | 3,80 GHz |
base | AMD SP3 |
nombre clave | Milán-X |
arquitectura | Zen 3 |
producción | 7 nm |
caché L2 | 8MB |
caché L3 | 768 MB |
carriles PCIE | 128x PCIe 4.0 |
TDP | 240 vatios |
Gráficos integrados | ninguna |
embalaje | BANDEJA |