English Barebone Lex Sky 3 3I170NX
prev
next
Barebone Lex Sky 3 3I170NX
- CPU Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 de 6.a / 7.a generación
- Chipset Intel® Q170
- 2 x zócalo SODIMM DDR4, máx. 32GB
- Pantalla independiente múltiple: VGA y HDMI
- 4 x PoE, 1 x Intel GbE, 2 x USB 3.0, 2 x COM
- 2 x mini PCIe
P/N: SK3I170NX
785,35 € Sin IVA
950,27 € Con IVA
Este producto no está disponible ni en nuestro almacén ni en ninguno de nuestros proveedores en estos momentos.
El precio que aparece es orientativo
El precio que aparece es orientativo
3 años
de garantía
de garantía
Envío
asegurado
asegurado
100%
pago seguro
pago seguro
Embedded Computer with 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 processor / 4 x PoE LAN / Support DIN Rail Mount
| System Dimension(WxDxH) | 183W x 141D x 66.9H mm | |
| Weight(Incl.M/B) | 2.8kg | |
| CPU | Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU | |
| Chipset | Intel® Q170 | |
| Memory | 2 x DDR4 SODIMM socket, Max. 32GB | |
| Storage | mSATA, HDD / SSD* | |
| Expansion slots | 1 x Full-size Mini PCIe ( PCIe / mSATA / USB) 1 x Half-size Mini PCIe (PCIe / mSATA / USB) |
|
| I/O ports | Network | 4 x PoE, 1 x Intel GbE |
| USB | 2 x USB 3.0 | |
| Serial ports | 2 x RS232 / 422 / 485 | |
| Display | 1 x VGA, 1 x HDMI | |
| GPIO | DI / DO (optional) | |
| Optional Modules & Accessory |
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI / DO, Video Input, *SATA Kit, VESA Mount Kit*, DIN Rail Mounting Kit* *External Power Adapter |
|
| Power | DC input : +12V~36V AC input : External adapter 100 / 240V (optional) |
|
| Operating Temp. (100 % CPU usage) |
-20°C to +50°C (Core i6700 TE) | |
| Storage Temp. | -20°C to +70°C | |
| Relative Humidity | 95% @ 40°C, non-condensing | |
Embedded Computer with 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 processor / 4 x PoE LAN / Support DIN Rail Mount
| System Dimension(WxDxH) | 183W x 141D x 66.9H mm | |
| Weight(Incl.M/B) | 2.8kg | |
| CPU | Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU | |
| Chipset | Intel® Q170 | |
| Memory | 2 x DDR4 SODIMM socket, Max. 32GB | |
| Storage | mSATA, HDD / SSD* | |
| Expansion slots | 1 x Full-size Mini PCIe ( PCIe / mSATA / USB) 1 x Half-size Mini PCIe (PCIe / mSATA / USB) |
|
| I/O ports | Network | 4 x PoE, 1 x Intel GbE |
| USB | 2 x USB 3.0 | |
| Serial ports | 2 x RS232 / 422 / 485 | |
| Display | 1 x VGA, 1 x HDMI | |
| GPIO | DI / DO (optional) | |
| Optional Modules & Accessory |
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI / DO, Video Input, *SATA Kit, VESA Mount Kit*, DIN Rail Mounting Kit* *External Power Adapter |
|
| Power | DC input : +12V~36V AC input : External adapter 100 / 240V (optional) |
|
| Operating Temp. (100 % CPU usage) |
-20°C to +50°C (Core i6700 TE) | |
| Storage Temp. | -20°C to +70°C | |
| Relative Humidity | 95% @ 40°C, non-condensing | |
×
