Español Barebone Lex Apollo RS PM170DW-4CXX
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Barebone Lex Apollo RS PM170DW-4CXX
- CPU Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 de 6.a / 7.a generación
- Chipset Intel® Q170
- 2 x zócalo SODIMM DDR4, máx. 32GB
- Pantalla independiente múltiple: HDMI y VGA
- 5 x Intel GbE LAN, 4 x USB 3.0, 2 x COM, 2 x SIM
- 2 x Mini PCIe, M.2, PCIe x16
P/N: APRSPM170DW-4CXX
841,27 € Without VAT
1.017,94 € With VAT
2 years
of guarantee
of guarantee
Envío
shipping
shipping
100%
Secure pay
Secure pay
High Performance 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 Fanless Embedded Computers / Stackable configuration Computer for CPU board & PCIe Backplanes / Flexibility I/O / expansion PCIe x 16
| System Dimension (WxDxH) | 231W x 93D x 173H mm |
| Weight (Incl.M/B) | 3.82 kg |
| CPU | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU |
| Chipset | Intel® Q170 |
| Memory | 2 x DDR4 SODIMM socket, Max. 32GB |
| Storage | mSATA, HDD / SSD*, M.2 |
| Expansion slots | 1 x Full-size Mini PCIe (PCIe / mSATA / USB) 1 x Full-size Mini PCIe (PCIe / USB) |
| I/O ports | Network: 5 x Intel GbE USB: 4 x USB 3.0 Serial ports: 2 x RS232 / 422 / 485 Display: 1 x VGA, 1 x HDMI PCIe slot: 1 x PCIe slot via RS701 |
| Optional Modules & Accessory | GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI/DO, Video Input, *SATA Kit, Wall Mount Kit |
| OEM IO Function | Audio, LAN, USB, DIO |
| Power | DC input: +12V~24V AC input: External adapter 100 / 240V AC-DC 120W |
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD (Core i6700 TE) 0°C to +50°C with HDD(Core i6700) |
| Storage Temp. | -20°C to +70°C |
| Relative Humidity | 95% @ 40°C, non-condensing |
High Performance 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 Fanless Embedded Computers / Stackable configuration Computer for CPU board & PCIe Backplanes / Flexibility I/O / expansion PCIe x 16
| System Dimension (WxDxH) | 231W x 93D x 173H mm |
| Weight (Incl.M/B) | 3.82 kg |
| CPU | 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU |
| Chipset | Intel® Q170 |
| Memory | 2 x DDR4 SODIMM socket, Max. 32GB |
| Storage | mSATA, HDD / SSD*, M.2 |
| Expansion slots | 1 x Full-size Mini PCIe (PCIe / mSATA / USB) 1 x Full-size Mini PCIe (PCIe / USB) |
| I/O ports | Network: 5 x Intel GbE USB: 4 x USB 3.0 Serial ports: 2 x RS232 / 422 / 485 Display: 1 x VGA, 1 x HDMI PCIe slot: 1 x PCIe slot via RS701 |
| Optional Modules & Accessory | GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, DI/DO, Video Input, *SATA Kit, Wall Mount Kit |
| OEM IO Function | Audio, LAN, USB, DIO |
| Power | DC input: +12V~24V AC input: External adapter 100 / 240V AC-DC 120W |
| Operating Temp. (100 % CPU usage) |
-20°C to +60°C with mSATA / SSD (Core i6700 TE) 0°C to +50°C with HDD(Core i6700) |
| Storage Temp. | -20°C to +70°C |
| Relative Humidity | 95% @ 40°C, non-condensing |
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